Space comes at a premium on electronic chips: Powerful electronics need more and more connections, crammed into smaller and smaller spaces. Established technologies are reaching the limits of what is physically possible. Now, researchers at Fraunhofer IZM-ASSID have teamed up with other partners to level up a connection technology patented by NanoWired GmbH that uses wires at a nanometer scale. The team demonstrated how the novel technology could be used in the industrial production of 300 mm wafers.
